Protective tape for the silicon wafer circuit surface during the water back-grinding process,"ICROS ™ TAPE" by Mitsui Chemicals Tohcello, Inc.

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Tape Type

ICROS™ Conventional Tapes (Non-UV and UV Types) Tape

Conventional Tapes - Non-UV Type

The non-UV conventional type of the ICROS™ backgrinding wafer tape line features little to no contamination transferred to the wafer surface, outstanding topography absorption, prevents water penetration and wafer breakage, and superior TTV.


 
  • Superior TTV
  • Soft & Hard type
  • Multiple thickness types
  • No residue after removal
  • Low ionic impurities
  • Easy detaping
  • Many adhesive types and strengths

 
  • Superior Total Thickness
  • Very Low Contamination
  • Easy Peel Off

Conventional Tapes - UV Type

The UV tape of the ICROS™ backgrinding wafer tape line features high adhesive strength, no contamination transferred to the wafer surface, outstanding topography absorption, prevents water penetration and wafer breakage, and superior TTV.

  • Superior TTV
  • Soft & Hard type
  • Multiple thickness types
  • No residue after removal
  • Low ionic impurities
  • Easy detaping
  • High adhesion strength

 
  • Superior Total Thickness
  • Very Low Contamination
  • High Adhesion
  • Easy Peel Off
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