Protective tape for the silicon wafer circuit surface during the water back-grinding process,"ICROS ™ TAPE" by Mitsui Chemicals Tohcello, Inc.

R&D products

Heat Resistant Tape

Application TSV process

Requirement for DC Tape

• 
  Height10-40um
• 

TSV Dicing Tape

Requirement for DC Tape

• 
  Height10-40um
• 
  Sufficient Distance
  Between Chips
  (e.g≧100㎛)
• 
  No Stress
  to avoid breakage
• 
• 

• Conventional Tapes
  (Non-UV and UV Types)
• Bumped Wafer Tapes
• R&D products
1. 1.Heat Resistant Tape
2. 2.TSV Dicing Tape

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