Protective tape for the silicon wafer circuit surface during the water back-grinding process,"ICROS ™ TAPE" by Mitsui Chemicals Tohcello, Inc.

ICROS™ Bumped Wafer Tape

The ICROS™ bumped wafer tape is the best solution for super high bumped wafers such as solder bump. It features a special resin middle layer for good bump absorption. Thin adhesive layer to prevent water penetration and wafer breakage.

• Superior TTV
• Special resin layer transforms to bump shape providing good bump absorption
• Low ionic impurities
• Both Non-UV and UV types adhesive available

 

• Conventional Tapes
  (Non-UV and UV Types)
• Bumped Wafer Tapes
• R&D products
1. 1.Heat Resistant Tape
2. 2.TSV Dicing Tape